USPTO issues Patent Number 9,421,005: Methods and Devices for Intracorporeal Bonding of Implants with Thermal Energy

Effingham, ILAugust 23, 2016

On August 23, 2016, the United States Patent and Trademark Office issued inventors Peter M. Bonutti, Matthew J. Cremens and Justin E. Beyers with U.S. Patent Number 9,421,005 for Intracorporeal Bonding of Implants.


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